Diane Simpson: Distinguished Alumni Lecture
Tuesday, April 5, 6pm
The Art Institute of Chicago
Rubloff Auditorium
Chicago-based artist Diane Simpson (BFA 1971, MFA 1978) creates sculptures and preparatory drawings that evolve from a diverse range of sources including clothing, utilitarian objects, and architecture. The structures of clothing forms has continuously informed her work, serving as a vehicle for exploring their functional and sociological roles and the influence of the design and architecture of various cultures and periods in history. Her wide selection of materials such as wood, perforated metal, linoleum, and fabric reflects her interest in the coexistence of the industrial/architectonic and domestic worlds. In 2010 a 30-year retrospective exhibition of her work was presented at the Chicago Cultural Center. Other recent one- and two-person exhibitions include Corbett vs. Dempsey, Chicago; JTT, New York; Silberkuppe, Berlin; Broadway Windows, Washington Square East Gallery, New York University; and Herald St., London. A major survey exhibition of Simpson’s work is on view at the Institute of Contemporary Art Boston through March 27, and she will have work on view at the Museum of Contemporary Art Chicago from February 16 to July 3.
Simpson has been included in numerous group exhibitions, including the Art Institute of Chicago; White Columns, New York; Herbert F. Johnson Museum of Art, Cornell University, New York; Anton Kern Gallery, New York; CCA Wattis Institute for Contemporary Arts, San Francisco; Mitchell-Innes and Nash, New York; Sikkema Jenkins & Co, New York; Kayne Griffin Corcoran, Los Angeles; and the Jewish Museum, New York. Her work is in the permanent collections of the Art Institute of Chicago; Hessel Museum of Art, New York; Illinois State Museum, Springfield; Kadist Foundation, Paris; Museum of Contemporary Art Chicago; Racine Art Museum, Wisconsin; Rockford Art Museum, Illinois; and the James R. Thompson Center, Chicago. Presented in partnership with SAIC’s Office of Alumni Relations.
More information is available here.